Fabrication, characterization of high-entropy alloys and deep learning-based inspection in metal additive manufacturing

Alloying has been used to confer desirable properties to materials. It typically involves the addition of small amounts of secondary elements to a primary element. In the past decade, however, a new alloying strategy that involves the combination of multiple principal elements in high concentrations to create new materials called high- entropy alloys (HEAs) has been in vogue. In the first part, the investigation focused on the fabrication process and property assessment of the additive manufactured HEA to broaden its engineering applications. Additive manufacturing (AM) is based on manufacturing philosophy through the layer-by-layer method and accomplish the near net-shaped components fabrication. Attempt was made to coat AlCoCrFeNi HEA on an AISI 304 stainless steel substrate to integrate their properties, however, it failed due to the cracks at the interface. The implementation of an intermediate layer improved the bond and eliminated the cracks. Next, an AlCoCrFeNiTi0.5 HEA coating was fabricated on the Ti6Al4V substrate, and its isothermal oxidation behavior was studied. The HEA coating effectively improved the Ti6Al4V substrate\u27s oxidation resistance due to the formation of continuous protective oxides. In the second part, research efforts were made on the deep learning-based quality inspection of additive manufactured products. The traditional inspection process has relied on manual recognition, which could suffer from low efficiency and potential bias. A neural-network approach was developed toward robust real-world AM anomaly detection. The results indicate the promising application of the neural network in the AM industry --Abstract, page iv

Effect and interactions of commercial additives and chloride ion in copper electrowinning

This thesis is to understand and compare the effects and interactions of modified polysaccharide (HydroStar), polyacrylamide (Cyquest N-900) and chloride ion on copper electrowinning. A study of the nucleation and growth was conducted in a synthetic electrolyte (40 g/L Cu, 160 g/L H₂SO₄, 20 mg/L Cl-) with the addition of HydroStar or Cyquest N-900 using potential step measurements. The current responses generated were compared to theoretical models of nucleation and growth mechanisms. The nucleation and growth mechanism changed as function of potential and the presence of organic additives. The nucleation and growth mechanisms were confirmed using scanning electron microscopy (SEM). At low overpotentials, electrodeposition from the electrolyte without additives proceeded by progressive nucleation with three-dimensional (3-D) growth. The addition of HydroStar produced smaller nuclei and changed the mechanism to progressive nucleation and 2-D growth. Cyquest N-900 used there appeared to be progressive nucleation with 2-D growth and polarize the cathodes. In addition, instantaneous nucleation under diffusion control occurred at high overpotentials. Chloride ion and its interaction with HydroStar and Cyquest N-900 were further characterized by cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). The trends observed from Nyquist plots and equivalent circuit models were consistent with the CV results. Chloride, on its own, depolarized copper electrodeposition, while chloride ion associated with Cyquest N-900 inhibited the reaction. It is proposed that Cl- acted as a bridging ligand between copper and Cyquest N-900. The addition of HydroStar depolarized copper deposition, but it did not interact with --Abstract, page iv